Yield Enhancement Engineer

The Yield Enhancement Engineer will drive yield improvement, defect reduction, process optimization, and
new technology development for advanced packaging technologies. The role requires strong analytical
capability, cross-functional collaboration, and hands-on experience with yield learning methodologies in
high-volume manufacturing environments.
Responsibilities
-Correlate process parameters with yield, reliability, and device performance metrics.
-Analyze electrical, inline, defectivity, and reliability data to identify yield loss mechanisms and drive corrective actions.
-Develop and execute yield improvement plans for NPI and high-volume manufacturing products.
-Perform process integration studies across lithography, etch, deposition, CMP, plating, cleaning, and metrology modules.
-Drive root cause analysis using DOE, SPC, Pareto analysis, FMEA, and statistical methodologies.
-Support technology transfer from development to manufacturing with stable process windows and manufacturability improvements.
-Work closely with process, equipment, quality, product, reliability, and customer teams to resolve technical issues.
-Monitor excursion trends and establish preventive actions to improve process robustness.
-Define process control strategies, specifications, and yield monitoring methodologies.
-Participate in failure analysis reviews and develop containment/corrective action plans.
-Support customer qualification activities and technical discussions.
-Generate technical reports, presentations, and documentation for management and customers

We are a company committed to creating diverse and inclusive environments where people can bring their full, authentic selves to work every day. We are an equal opportunity/affirmative action employer that believes everyone matters. Qualified candidates will receive consideration for employment regardless of their race, color, ethnicity, religion, sex (including pregnancy), sexual orientation, gender identity and expression, marital status, national origin, ancestry, genetic factors, age, disability, protected veteran status, military or uniformed service member status, or any other status or characteristic protected by applicable laws, regulations, and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application or recruiting process, please send a request to HR@insightglobal.com.To learn more about how we collect, keep, and process your private information, please review Insight Global's Workforce Privacy Policy: https://insightglobal.com/workforce-privacy-policy/.

-Bachelor’s degree in Materials Science, Chemical Engineering, Electrical Engineering, Physics, or related field
-3 years of semiconductor Process Integration or Yield Engineering experience
-Strong understanding of semiconductor fabrication or advanced packaging process flows.
-Experience with statistical data analysis tools such as JMP, Minitab, Python, or Excel.
Knowledge of SPC, DOE, Cp/Cpk, yield analysis, and defect reduction methodologies.
-Familiarity with electrical test data analysis and inline metrology correlation.
-Experience supporting NPI and high-volume manufacturing environments.

-Master’s degree or higher in Materials Science, Chemical Engineering, Electrical Engineering, Physics, or related field
-Experience in advanced packaging technologies such as hybrid bonding, TSV, Cu damascene, or wafer-level packaging
-Knowledge of reliability failure mechanisms and FA techniques.

Benefit packages for this role will start on the 1st day of employment and include medical, dental, and vision insurance, as well as HSA, FSA, and DCFSA account options, and 401k retirement account access with employer matching. Employees in this role are also entitled to paid sick leave and/or other paid time off as provided by applicable law.